• DocumentCode
    2201974
  • Title

    Modeling and analysis for an equipment manager of the manufacturing execution system in semiconductor packaging factories

  • Author

    Cheng, Fan-tien ; Kuo, Tsung-Liang ; Feng, Chengche

  • Author_Institution
    Inst. of Manuf. Eng., Nat. Cheng Kung Univ., Tainan, Taiwan
  • Volume
    1
  • fYear
    1998
  • fDate
    11-14 Oct 1998
  • Firstpage
    469
  • Abstract
    The equipment manager plays one of the major roles in a manufacturing execution system (MES). It is the communication bridge between the components of MES and the equipment. The soul of an equipment manager is its control algorithm. The purpose of this paper is to develop such a control algorithm. The domain knowledge and requirements are collected from a real semiconductor packaging factory. By using the IDEF0 methodology and the system state diagrams, the functional model and the dynamic model of the control algorithm are built. Then, the control algorithm is translated into the Petri-net model. This allows the qualitative and quantitative analysis of the system. The Petri-net model of the equipment manager is included into the MES Petri-net model. As such, the performance of an equipment manager in the MES environment can be evaluated. These evaluation results are good references for design and decision-making. Finally, the proper control algorithm is converted into the application program of the equipment manager.
  • Keywords
    Petri nets; integrated circuit bonding; integrated circuit manufacture; integrated circuit packaging; production control; semiconductor process modelling; IDEF0 methodology; MES; Petri-net model; domain knowledge; dynamic model; equipment manager; functional model; manufacturing execution system; qualitative analysis; quantitative analysis; semiconductor packaging factories; system state diagrams; Algorithm design and analysis; Communication system control; Computerized monitoring; Manufacturing automation; Packaging machines; Production facilities; Semiconductor device manufacture; Semiconductor device packaging; Semiconductor process modeling; Virtual manufacturing;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Systems, Man, and Cybernetics, 1998. 1998 IEEE International Conference on
  • ISSN
    1062-922X
  • Print_ISBN
    0-7803-4778-1
  • Type

    conf

  • DOI
    10.1109/ICSMC.1998.725456
  • Filename
    725456