RF MEMS switches for 3D-IC phased array antenna modules

Author

Wang, Yu Albert ; Ferendeci, Altan M.

Author_Institution

Microwave & Millimeter Wave Electron. Lab., Cincinnati Univ., OH, USA

fYear

2002

fDate

2002

Firstpage

269

Lastpage

272

Abstract

This paper presents modeling, design, fabrication, and measurement of a novel shunt capacitive RF MEMS switch. The switches are processed on a polyimide substrate in an intermediate layer of a monolithically processed vertically interconnected 3D-IC phased array antenna module at X-band. The copper switches have a pull-down voltage of 12 V and life cycle of at least 10⁷ actuations. The switches demonstrated less than 0.2 dB insertion loss and 11.5 to 17.1 dB isolation at X-band. Measurement results confirmed that the distributed modeling of the MEMS switches presented here improved the design of parallel-configured RF MEMS switches in phase shifters.

Keywords

antenna phased arrays; microswitches; modules; phase shifters; 0.2 dB; 12 V; 3D-IC phased array antenna modules; X-band; copper switches; distributed element model; life cycle; lumped element model; parallel-configured RF MEMS switches; phase shifters; polyimide substrate; pull-down voltage; switch design; switch fabrication; switch measurement; switch modeling; Antenna arrays; Antenna measurements; Copper; Fabrication; Phased arrays; Polyimides; Radiofrequency microelectromechanical systems; Switches; Three-dimensional integrated circuits; Voltage;

fLanguage

English

Publisher

ieee

Conference_Titel

Radio and Wireless Conference, 2002. RAWCON 2002. IEEE

Print_ISBN

0-7803-7458-4

Type

conf

DOI

10.1109/RAWCON.2002.1030169

Filename

1030169