DocumentCode
2202900
Title
Package Level Simulation and Verification of Microsystems
Author
Song, Jing ; Li, Ming ; Huang, Qing-An ; Tang, Jie-ying
Author_Institution
Southeast Univ., Nanjing
fYear
2007
fDate
28-31 Oct. 2007
Firstpage
99
Lastpage
102
Abstract
This paper presents a modified concept of a generalized nodal analysis method (NAM) to theoretically model the packaged MEMS device and simplify the package-level simulation of microsystems. Non-device elements are included and a new kind of distributed node is defined to expand the usability of NAM. Experiment verification based on DSCM and LDV are also carried out to validate the simulated results.
Keywords
micromechanical devices; semiconductor device packaging; distributed node; generalized nodal analysis method; microsystems; package level simulation; packaged MEMS device; Analytical models; Integrated circuit modeling; Integrated circuit packaging; Laboratories; Microelectromechanical devices; Micromechanical devices; Semiconductor device measurement; Testing; Thermal stresses; Usability;
fLanguage
English
Publisher
ieee
Conference_Titel
Sensors, 2007 IEEE
Conference_Location
Atlanta, GA
ISSN
1930-0395
Print_ISBN
978-1-4244-1261-7
Electronic_ISBN
1930-0395
Type
conf
DOI
10.1109/ICSENS.2007.4388345
Filename
4388345
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