• DocumentCode
    2203449
  • Title

    Distributed Memory Management Units Architecture for NoC-based CMPs

  • Author

    Man, Cao ; Bin, Xie ; Fuming, Qiao ; Qingsong, Shi ; Tianzhou, Chen ; Like, Yan

  • Author_Institution
    Coll. of Comput. Sci., Intel Technol. Center, Zhejiang Univ., Hangzhou, China
  • fYear
    2010
  • fDate
    June 29 2010-July 1 2010
  • Firstpage
    54
  • Lastpage
    61
  • Abstract
    Network on Chip (NoC) is considered as the promising diagram of interconnection mechanism for future chip multiprocessors. As the number of processing elements (PE) on chip keeps growing, the delay for simultaneous memory references of these PEs is emerging as a serious bottleneck on high performance. One major part of this delay is from the Memory Management Unit (MMU) due to its centralized structure. In this paper, we propose a novel distributed MMU architecture for NoC-based CMPs, which can effectively reduce the bottleneck effect in contrast of traditional MMU. We discuss the benefit of this architecture in aspects of TLB hit rate, network communication efficiency, memory bandwidth and coherence. Experimental results show that the distributed MMU structure significantly improves network throughput balance and lowers communicational delay.
  • Keywords
    integrated circuit interconnections; memory architecture; multiprocessing systems; network-on-chip; NoC-based CMP; TLB hit rate; centralized structure; chip multiprocessors; communicational delay; distributed MMU architecture; distributed memory management unit architecture; interconnection mechanism; memory bandwidth; network communication efficiency; network on chip; processing elements; Bandwidth; Hardware; Memory management; Program processors; System-on-a-chip; Throughput; memory management unit; network on chip; on-chip communication;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Computer and Information Technology (CIT), 2010 IEEE 10th International Conference on
  • Conference_Location
    Bradford
  • Print_ISBN
    978-1-4244-7547-6
  • Type

    conf

  • DOI
    10.1109/CIT.2010.53
  • Filename
    5578429