• DocumentCode
    2204123
  • Title

    Exfoliation of GaN layers using hydrogen implantation

  • Author

    Hayashi, S. ; Poust, B. ; Heying, B. ; Goorsky, M.

  • Author_Institution
    Dept. of Mater. Sci. & Eng., California Univ., Los Angeles, CA, USA
  • fYear
    2003
  • fDate
    25-27 Aug. 2003
  • Firstpage
    106
  • Lastpage
    107
  • Abstract
    In this paper, the successful exfoliation of 200 nm GaN layers grown on sapphire substrates was achieved usiing H2+ implantation and subsequent annealing. We demonstrate that the extent of exfoliation depends not only on the implant dose, but also on the crystallinity of the GaN layer. Extended defects are not uniformally distributed over the wafer, so certain areas showed much more pronounced exfoliation than other areas.
  • Keywords
    III-V semiconductors; annealing; gallium compounds; ion implantation; semiconductor epitaxial layers; surface treatment; wide band gap semiconductors; 600 to 200 nm; Al2O3; GaN; GaN layer exfoliation; annealing; crystallinity; hydrogen implantation dose; sapphire substrate; Annealing; Capacitive sensors; Crystallization; Gallium nitride; Hydrogen; Implants; Semiconductor materials; Space technology; Strain measurement; Substrates;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Compound Semiconductors, 2003. International Symposium on
  • Print_ISBN
    0-7803-7820-2
  • Type

    conf

  • DOI
    10.1109/ISCS.2003.1239928
  • Filename
    1239928