DocumentCode
2204123
Title
Exfoliation of GaN layers using hydrogen implantation
Author
Hayashi, S. ; Poust, B. ; Heying, B. ; Goorsky, M.
Author_Institution
Dept. of Mater. Sci. & Eng., California Univ., Los Angeles, CA, USA
fYear
2003
fDate
25-27 Aug. 2003
Firstpage
106
Lastpage
107
Abstract
In this paper, the successful exfoliation of 200 nm GaN layers grown on sapphire substrates was achieved usiing H2+ implantation and subsequent annealing. We demonstrate that the extent of exfoliation depends not only on the implant dose, but also on the crystallinity of the GaN layer. Extended defects are not uniformally distributed over the wafer, so certain areas showed much more pronounced exfoliation than other areas.
Keywords
III-V semiconductors; annealing; gallium compounds; ion implantation; semiconductor epitaxial layers; surface treatment; wide band gap semiconductors; 600 to 200 nm; Al2O3; GaN; GaN layer exfoliation; annealing; crystallinity; hydrogen implantation dose; sapphire substrate; Annealing; Capacitive sensors; Crystallization; Gallium nitride; Hydrogen; Implants; Semiconductor materials; Space technology; Strain measurement; Substrates;
fLanguage
English
Publisher
ieee
Conference_Titel
Compound Semiconductors, 2003. International Symposium on
Print_ISBN
0-7803-7820-2
Type
conf
DOI
10.1109/ISCS.2003.1239928
Filename
1239928
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