DocumentCode :
2204123
Title :
Exfoliation of GaN layers using hydrogen implantation
Author :
Hayashi, S. ; Poust, B. ; Heying, B. ; Goorsky, M.
Author_Institution :
Dept. of Mater. Sci. & Eng., California Univ., Los Angeles, CA, USA
fYear :
2003
fDate :
25-27 Aug. 2003
Firstpage :
106
Lastpage :
107
Abstract :
In this paper, the successful exfoliation of 200 nm GaN layers grown on sapphire substrates was achieved usiing H2+ implantation and subsequent annealing. We demonstrate that the extent of exfoliation depends not only on the implant dose, but also on the crystallinity of the GaN layer. Extended defects are not uniformally distributed over the wafer, so certain areas showed much more pronounced exfoliation than other areas.
Keywords :
III-V semiconductors; annealing; gallium compounds; ion implantation; semiconductor epitaxial layers; surface treatment; wide band gap semiconductors; 600 to 200 nm; Al2O3; GaN; GaN layer exfoliation; annealing; crystallinity; hydrogen implantation dose; sapphire substrate; Annealing; Capacitive sensors; Crystallization; Gallium nitride; Hydrogen; Implants; Semiconductor materials; Space technology; Strain measurement; Substrates;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Compound Semiconductors, 2003. International Symposium on
Print_ISBN :
0-7803-7820-2
Type :
conf
DOI :
10.1109/ISCS.2003.1239928
Filename :
1239928
Link To Document :
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