Title :
A study on thermal stress of power IC die bonding
Author :
Wang, Yangang ; Wang, Yajie ; Cui, Xueqing ; Wu, Wuchen
Author_Institution :
Electron. Eng. Dept., Beijing Polytech. Univ., China
Abstract :
Thermal stress due to the thermal mismatch in power IC packaging will affect the long-term reliability of a power IC. This paper studied the thermal stress analysis method and a way to reduce the stress in an IC chip. Numerical distribution values of thermal stress in chip packaging and the optimal parameter design method to reduce chip thermal stress were also provided in this paper
Keywords :
integrated circuit bonding; integrated circuit packaging; integrated circuit reliability; power integrated circuits; stress analysis; thermal analysis; thermal management (packaging); thermal stresses; chip packaging; long-term reliability; optimal parameter design method; power IC die bonding; power IC packaging; stress reduction; thermal mismatch; thermal stress analysis method; thermal stress simulation; Ceramics; Electronic packaging thermal management; Integrated circuit packaging; Microassembly; Power integrated circuits; Residual stresses; Temperature; Thermal conductivity; Thermal engineering; Thermal stresses;
Conference_Titel :
Solid-State and Integrated-Circuit Technology, 2001. Proceedings. 6th International Conference on
Conference_Location :
Shanghai
Print_ISBN :
0-7803-6520-8
DOI :
10.1109/ICSICT.2001.981434
