• DocumentCode
    2204725
  • Title

    An Analysis the Effect of Compound Electrode Materials to Transient Recovery Voltage and Chopping Current in Low-Current Vacuum Arc

  • Author

    Sumransuk, T. ; Chayawanich, N. ; Mungkung, N.

  • Author_Institution
    Dept. of Electr. Eng., King Mongkut´´s Univ. of Technol., Bangkok
  • fYear
    2006
  • fDate
    14-17 Nov. 2006
  • Firstpage
    1
  • Lastpage
    4
  • Abstract
    The purpose of this research was to analyses and compare the instability of a contact surface between copper and nickel as an alloy cathode in vacuum, the different ratio of copper and nickel were conducted at 1%, 4% and 6% by using the cathode spot model which is recognized as the collisionless space charge sheath connected with singly ionized collisional plasma. It was found that the minimum stable arc current is highly dependent on the thermal conductivity of the cathode material due to amount of percent nickel. The chopping current is proportional to the level of minimum stable arc current. As results, the smaller recovery voltage which is induced by chopping current. This is a very important result for the development of cathode materials for low-surge vacuum interrupters. The results obtained by this study clearly demonstrate the physical mechanism of current instability occurrence, the level of chopping current and the recovery voltage in power system
  • Keywords
    cathodes; copper alloys; electrical contacts; nickel alloys; space charge; transients; vacuum arcs; vacuum interrupters; alloy cathode; cathode spot model; chopping current; collisionless space charge sheath; contact instability; copper; electrode material; ionized collisional plasma; nickel; power system; transient recovery voltage; vacuum arc; Cathodes; Conducting materials; Copper; Electrodes; Nickel; Power system transients; Thermal conductivity; Transient analysis; Vacuum arcs; Voltage;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    TENCON 2006. 2006 IEEE Region 10 Conference
  • Conference_Location
    Hong Kong
  • Print_ISBN
    1-4244-0548-3
  • Electronic_ISBN
    1-4244-0549-1
  • Type

    conf

  • DOI
    10.1109/TENCON.2006.343736
  • Filename
    4142411