Title :
Multi-physics analysis of heat-structure on surface resistance
Author :
Hu, Jianxu ; Meng, Maozhou
Author_Institution :
Shenzhen Inst. of Adv. Technol., Grad. Univ. of Chinese Acad. of Sci., Shenzhen, China
Abstract :
The failure of electronic systems and equipment mostly happens in the welding parts between components and circuit board while the cycles of thermal expansion achieve a certain number, because the solder comes to fatigue cracking. In this paper, a sample about surface resistance was chosen to explain what relationship among the electric field, heat transfer, and structure expansion by using the multi-physics modeling and simulation software, COMSOL Multiphysics, to model these three physical fields in fully coupling. The components of the electric field, temperature field and stress field distribution were extracted to explain the interaction among these three physics fields. According to the results of numerical simulation, the engineer will be inspired to obtain an optimization structure and process.
Keywords :
computational electromagnetics; electric fields; electrical faults; electronic equipment testing; failure analysis; fatigue cracks; heat transfer; solders; surface resistance; temperature; thermal expansion; COMSOL simulation software; circuit board; electric field; electronic system failure; equipment failure; fatigue cracking; heat structure; heat transfer; multiphysics analysis; multiphysics modeling; solder; stress field distribution; structure expansion; surface resistance; temperature field; thermal expansion; welding part; Computational modeling; Equations; Heat transfer; Mathematical model; Resistors; Stress; COMSOL; FEA; Full coupling; Multi-physics; Optimization design;
Conference_Titel :
Information and Automation (ICIA), 2011 IEEE International Conference on
Conference_Location :
Shenzhen
Print_ISBN :
978-1-4577-0268-6
Electronic_ISBN :
978-1-4577-0269-3
DOI :
10.1109/ICINFA.2011.5949121
