• DocumentCode
    2205560
  • Title

    Nitrogen in Czochralski silicon

  • Author

    Yang, Deren ; Que, Duanlin

  • Author_Institution
    State Key Lab. of Silicon, Zhejiang Univ., Hangzhou, China
  • Volume
    1
  • fYear
    2001
  • fDate
    2001
  • Firstpage
    255
  • Abstract
    Nitrogen is an interesting element in Czochralski (CZ) silicon used for microelectronic industry. In recent, nitrogen has attracted much attention due to its influence on microdefects, intrinsic gettering and mechanical strength in the larger diameter CZ silicon, This paper gives a review of nitrogen in CZ silicon which has an effect on the mechanical and electrical properties of silicon material and devices. The basic behavior of nitrogen in CZ silicon, such as doping techniques, diffusion coefficient et al, is introduced. It is indicated that nitrogen can lock the movement of dislocations so as to increase to mechanical strength. It is also reported that nitrogen interacts with oxygen, generates nitrogen-oxygen complexes and enhance the nucleation of oxygen precipitation. Moreover, the effect of nitrogen on void defects and intrinsic gettering is described. Finally, the mechanism of N-O complex formation and elimination will be also discussed
  • Keywords
    diffusion; elemental semiconductors; getters; impurity-dislocation interactions; mechanical strength; nitrogen; oxygen; precipitation; reviews; semiconductor doping; silicon; voids (solid); CZ silicon; Czochralski silicon; Si:N,O; diffusion coefficient; dislocations; doping techniques; electrical properties; intrinsic gettering; mechanical strength; microdefects; nitrogen; nitrogen-oxygen complexes; nucleation; oxygen; oxygen precipitation; review; void defects; Electrons; Gettering; Impurities; Laboratories; Lattices; Mechanical factors; Microelectronics; Nitrogen; Silicon; Vibrations;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Solid-State and Integrated-Circuit Technology, 2001. Proceedings. 6th International Conference on
  • Conference_Location
    Shanghai
  • Print_ISBN
    0-7803-6520-8
  • Type

    conf

  • DOI
    10.1109/ICSICT.2001.981468
  • Filename
    981468