DocumentCode
2205723
Title
Deposition of nano-sized metal-oxide using inductively coupled plasma chemical vapor deposition (ICP-CVD) technique for gas sensors applications
Author
Srivastava, Anurag ; Tan, O.K. ; Ang, L.K. ; Tse, M.S. ; Lee, Y.C.
Author_Institution
Div. of Microelectron., Nanyang Technol. Univ., Singapore
fYear
2002
fDate
26-30 May 2002
Firstpage
134
Abstract
Summary form only given, as follows. We propose a unique single-source sol-gel ICP-CVD (inductively-coupled plasma chemical vapor deposition) system to synthesize nano-scale metal-oxide materials as sensing layers on silicon for fabrication into gas sensors. We intend to compare our results with the existing techniques such as sol-gel, RF sputtering. Our ICP-CVD system has an inductive couple matching at 13.56 MHz and the capability of sustaining up to 2 kW of RF power. The chemical precursor is injected into the system in vapor phase (in a controlled manner) by a liquid injection system. A Langmuir probe is installed inside the ICP system to provide reliable characterization and modeling for the ICP system. A few DC biased silicon grids are assembled at some desirable distances from the plasma column in order to extract and direct the flow of ions for a uniform deposition of nano-sized metal-oxide ions on to the silicon substrate. In this paper, preliminary results of the deposited film´s material properties of tin-oxide will be characterized as a function of ICP power, chamber pressure, gas chemistry, gas flow rate, substrate temperature, and DC bias grid configurations. Modeling and simulation of the deposition system will be presented.
Keywords
gas sensors; nanostructured materials; plasma CVD; plasma CVD coatings; semiconductor growth; semiconductor thin films; tin compounds; 13.56 MHz; 2 kW; DC biased grids; ICP power; SnO/sub 2/; chamber pressure; gas chemistry; gas flow rate; gas sensor; nanosized metal-oxide deposition; plasma column; single-source sol-gel ICP-CVD; substrate temperature; Chemical vapor deposition; Gas detectors; Inorganic materials; Nanostructured materials; Plasma applications; Plasma chemistry; Plasma materials processing; Power system modeling; Radio frequency; Silicon;
fLanguage
English
Publisher
ieee
Conference_Titel
Plasma Science, 2002. ICOPS 2002. IEEE Conference Record - Abstracts. The 29th IEEE International Conference on
Conference_Location
Banff, Alberta, Canada
Print_ISBN
0-7803-7407-X
Type
conf
DOI
10.1109/PLASMA.2002.1030313
Filename
1030313
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