Title :
The research of silicon wafer´s polishing fog
Author :
Di, Weiguo ; Liu, Yuling ; Tan, Baimei ; Li, Weiwei ; Yang, Ming
Author_Institution :
Hebei Univ. of Technol., Tianjin, China
Abstract :
In this paper, the mechanism of producing polishing fog is studied. The factors that influence polishing fog are analysis. Optimizing polishing technology on the basis of experiments can control the polishing fog
Keywords :
chemical mechanical polishing; elemental semiconductors; integrated circuit technology; semiconductor technology; silicon; CMP; Si; Si wafer; ageing; optimisation; polishing fog; surface quality; surfactant; Chemical technology; Chemistry; Manufacturing; Polymers; Rough surfaces; Silicon compounds; Slurries; Surface morphology; Surface roughness; Wafer bonding;
Conference_Titel :
Solid-State and Integrated-Circuit Technology, 2001. Proceedings. 6th International Conference on
Conference_Location :
Shanghai
Print_ISBN :
0-7803-6520-8
DOI :
10.1109/ICSICT.2001.981477
