• DocumentCode
    2205764
  • Title

    Schottky Contacts on Single-Crystal CVD Diamond

  • Author

    Doneddu, D. ; Guy, O.J. ; Twitchen, D. ; Tajani, A. ; Schwitters, M. ; Igic, P.

  • Author_Institution
    Sch. of Eng., Wales Univ., Swansea
  • fYear
    0
  • fDate
    0-0 0
  • Firstpage
    179
  • Lastpage
    182
  • Abstract
    In this paper, a comparison of gold, nickel and aluminium Schottky diodes fabricated on high-quality, single-crystal CVD diamond is presented. Different metals, such as gold, nickel and aluminium, have been deposited on the oxidised surface of an intrinsic diamond layer to serve as Schottky contacts, in order to investigate the physical properties of the different metal-semiconductor interfaces. A Cr-layer, followed by a subsequent Au deposition was used to form the ohmic back contact for the Au-Schottky diodes, whereas a Cr-layer followed by a Ni deposition formed the ohmic contact for the Ni and Al-Schottky contacts. Contacts have been characterized using I-V measurements. The gold Schottky contacts exhibited reverse leakage currents as low as 0.01 muA at a reverse voltage of -600V, rising to 10 -A at 1kV (without any periphery protection). Nickel and aluminium contacts exhibited lower reverse leakage currents and higher average breakdown voltages, whilst giving poorer forward conduction
  • Keywords
    Schottky barriers; Schottky diodes; aluminium; chemical vapour deposition; chromium; diamond; gold; leakage currents; metal-semiconductor-metal structures; nickel; ohmic contacts; semiconductor device breakdown; -600 V; 1 kV; Au deposition; Au-Schottky diodes; Schottky contacts; breakdown voltages; chemical vapor deposition; intrinsic diamond layer; metal-semiconductor interfaces; ohmic back contact; oxidised surface; reverse leakage currents; single-crystal CVD diamond; Aluminum; Gold; Leakage current; Nickel; Ohmic contacts; Protection; Schottky barriers; Schottky diodes; Semiconductor-metal interfaces; Voltage;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Microelectronics, 2006 25th International Conference on
  • Conference_Location
    Belgrade
  • Print_ISBN
    1-4244-0117-8
  • Type

    conf

  • DOI
    10.1109/ICMEL.2006.1650924
  • Filename
    1650924