• DocumentCode
    2205780
  • Title

    Dynamic Thermal Simulation of Power Devices Operating with PWM Signals

  • Author

    Zhou, Z. ; Khanniche, M.S. ; Igic, P. ; Jankovic, N. ; Batcup, S.G. ; Mawby, P.A.

  • Author_Institution
    Sch. of Eng., Wales Univ., Swansea
  • fYear
    0
  • fDate
    0-0 0
  • Firstpage
    183
  • Lastpage
    186
  • Abstract
    Fast power devices thermal simulation method based on averaging power losses over each cycle of PWM switching frequency is presented in this paper. For implementing a long real time dynamic thermal simulation of power devices, device power losses during transient process and static characteristics are defined as a function of device conduction current and junction temperature, and are represented by a lookup table. By carrying out the circuit electrical simulation, the device conduction current can be obtained. By combining the device conduction currents, global device temperature (GDT) and the data from the lookup table, the average power loss over each cycle of PWM switching frequency is then calculated for carrying out the thermal simulation. With the proposed method, a relative large simulation time step can be employed and simulation speed can be increased dramatically. The method is suitable for a long real time thermal simulation for complex power electronics systems
  • Keywords
    power semiconductor devices; pulse width modulation; semiconductor device models; table lookup; PWM signals; PWM switching frequency; circuit electrical simulation; device conduction current; device power losses; dynamic thermal simulation; global device temperature; junction temperature; lookup table; power devices; static characteristics; transient process; Circuit simulation; Electronic packaging thermal management; Multichip modules; Power system modeling; Predictive models; Pulse width modulation; Pulse width modulation inverters; Switching frequency; Temperature; Vehicle dynamics;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Microelectronics, 2006 25th International Conference on
  • Conference_Location
    Belgrade
  • Print_ISBN
    1-4244-0117-8
  • Type

    conf

  • DOI
    10.1109/ICMEL.2006.1650925
  • Filename
    1650925