DocumentCode
2205780
Title
Dynamic Thermal Simulation of Power Devices Operating with PWM Signals
Author
Zhou, Z. ; Khanniche, M.S. ; Igic, P. ; Jankovic, N. ; Batcup, S.G. ; Mawby, P.A.
Author_Institution
Sch. of Eng., Wales Univ., Swansea
fYear
0
fDate
0-0 0
Firstpage
183
Lastpage
186
Abstract
Fast power devices thermal simulation method based on averaging power losses over each cycle of PWM switching frequency is presented in this paper. For implementing a long real time dynamic thermal simulation of power devices, device power losses during transient process and static characteristics are defined as a function of device conduction current and junction temperature, and are represented by a lookup table. By carrying out the circuit electrical simulation, the device conduction current can be obtained. By combining the device conduction currents, global device temperature (GDT) and the data from the lookup table, the average power loss over each cycle of PWM switching frequency is then calculated for carrying out the thermal simulation. With the proposed method, a relative large simulation time step can be employed and simulation speed can be increased dramatically. The method is suitable for a long real time thermal simulation for complex power electronics systems
Keywords
power semiconductor devices; pulse width modulation; semiconductor device models; table lookup; PWM signals; PWM switching frequency; circuit electrical simulation; device conduction current; device power losses; dynamic thermal simulation; global device temperature; junction temperature; lookup table; power devices; static characteristics; transient process; Circuit simulation; Electronic packaging thermal management; Multichip modules; Power system modeling; Predictive models; Pulse width modulation; Pulse width modulation inverters; Switching frequency; Temperature; Vehicle dynamics;
fLanguage
English
Publisher
ieee
Conference_Titel
Microelectronics, 2006 25th International Conference on
Conference_Location
Belgrade
Print_ISBN
1-4244-0117-8
Type
conf
DOI
10.1109/ICMEL.2006.1650925
Filename
1650925
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