Title :
IC interconnect technology-challenges and opportunities
Author_Institution :
Conexant Syst. Inc., Newport Beach, CA, USA
Abstract :
This paper reviews the status and challenges in interconnect technologies for integrated circuits (IC) applications. In order to meet the requirements in performance. power consumption, reliability, processing cost, and manufacturing yield, new materials and integration architectures must be introduced to IC interconnects while novel circuit architectures and new design schemes must be explored to mitigate the challenges and difficulties. The technological challenges in IC interconnects provide tremendous multidisciplinary and innovative research and development opportunities in architectures, processing, integration, materials, and characterization methodologies
Keywords :
VLSI; chemical mechanical polishing; integrated circuit economics; integrated circuit interconnections; integrated circuit reliability; CMP; IC interconnects; integrated circuits; interconnect technologies; manufacturing yield; on-chip interconnect; power consumption; processing cost; reliability; Application specific integrated circuits; Costs; Energy consumption; Integrated circuit interconnections; Integrated circuit manufacture; Integrated circuit reliability; Integrated circuit technology; Integrated circuit yield; Manufacturing processes; Materials reliability;
Conference_Titel :
Solid-State and Integrated-Circuit Technology, 2001. Proceedings. 6th International Conference on
Conference_Location :
Shanghai
Print_ISBN :
0-7803-6520-8
DOI :
10.1109/ICSICT.2001.981489
