IC interconnect technology-challenges and opportunities

Author

Zhao, Bin

Author_Institution

Conexant Syst. Inc., Newport Beach, CA, USA

Volume

1

fYear

2001

fDate

2001

Firstpage

337

Abstract

This paper reviews the status and challenges in interconnect technologies for integrated circuits (IC) applications. In order to meet the requirements in performance. power consumption, reliability, processing cost, and manufacturing yield, new materials and integration architectures must be introduced to IC interconnects while novel circuit architectures and new design schemes must be explored to mitigate the challenges and difficulties. The technological challenges in IC interconnects provide tremendous multidisciplinary and innovative research and development opportunities in architectures, processing, integration, materials, and characterization methodologies

Keywords

VLSI; chemical mechanical polishing; integrated circuit economics; integrated circuit interconnections; integrated circuit reliability; CMP; IC interconnects; integrated circuits; interconnect technologies; manufacturing yield; on-chip interconnect; power consumption; processing cost; reliability; Application specific integrated circuits; Costs; Energy consumption; Integrated circuit interconnections; Integrated circuit manufacture; Integrated circuit reliability; Integrated circuit technology; Integrated circuit yield; Manufacturing processes; Materials reliability;

fLanguage

English

Publisher

ieee

Conference_Titel

Solid-State and Integrated-Circuit Technology, 2001. Proceedings. 6th International Conference on

Conference_Location

Shanghai

Print_ISBN

0-7803-6520-8

Type

conf

DOI

10.1109/ICSICT.2001.981489

Filename

981489