• DocumentCode
    2206155
  • Title

    Investigation of Random Rough Surface Effects in Interconnect Resistance Extraction Utilizing Effective Conductivity

  • Author

    Chen, Quan ; Wong, Ngai

  • Author_Institution
    Dept. of Electr. & Electron. Eng., Univ. of Hong Kong
  • fYear
    2006
  • fDate
    14-17 Nov. 2006
  • Firstpage
    1
  • Lastpage
    4
  • Abstract
    Due to the decreasing skin depth in high-frequency analog and digital circuits, surface roughness is playing an increasingly important role in interconnect parasitic extraction. However, the inaccessibility of explicit surface expression and the complicated electromagnetic (EM) nature baffle the satisfactory solution to this kind of problems. In this paper, the impact of random surface roughness on the frequency-dependent resistance extraction for interconnects is quantitively evaluated by the concept of effective conductivity. The surface information is given in terms of statistical description instead of explicit functions. We combine the equivalent source method with the Monte Carlo simulation, called generalized equivalent source method (GESM), to analyze the behavior of EM wave on random rough surfaces. These techniques simplify the investigation of rough surface effects in interconnect parasitic extractions and full-wave analyses for signal integrity
  • Keywords
    integrated circuit interconnections; rough surfaces; surface electromagnetic waves; EM wave; GESM; Monte Carlo simulation; digital circuit; generalized equivalent source method; high-frequency analog circuit; interconnect resistance extraction; random rough surface effect; Conductivity; Data mining; Digital circuits; Frequency; Integrated circuit interconnections; Rough surfaces; Skin; Surface resistance; Surface roughness; Surface waves;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    TENCON 2006. 2006 IEEE Region 10 Conference
  • Conference_Location
    Hong Kong
  • Print_ISBN
    1-4244-0548-3
  • Electronic_ISBN
    1-4244-0549-1
  • Type

    conf

  • DOI
    10.1109/TENCON.2006.343796
  • Filename
    4142471