• DocumentCode
    2206292
  • Title

    Branch Line Coupler on an Artificial Dielectric Substrate

  • Author

    Machac, Jan ; FABIAN, Jose ; Protiva, Pavel

  • Author_Institution
    Dept. of Electromagn. Field, Czech Tech. Univ. in Prague, Prague
  • fYear
    2008
  • fDate
    23-24 April 2008
  • Firstpage
    1
  • Lastpage
    4
  • Abstract
    This paper presents a possible application of an artificial dielectric substrate. The substrate is fabricated as a 2D array of metallic posts separated from the top conductor by a thin dielectric slab. The effective permittivity of a microstrip line fabricated on this substrate depends on the dimensions of the posts, the permittivity of a dielectric material filling the space between the posts, and on the thickness and permittivity of the top dielectric slab. The thinner this slab is and the higher its permittivity is the higher the effective permittivity will be. Due to the high effective permittivity, a substantial reduction in the dimensions of the microwave circuit elements is possible. Two 3 dB branch line couplers were designed, fabricated and measured by applying the microstrip line on this artificial dielectric substrate. They have considerably smaller dimensions than a coupler on a standard substrate.
  • Keywords
    dielectric materials; microstrip couplers; microwave circuits; permittivity; 2D array; artificial dielectric substrate; branch line coupler; dielectric material; effective permittivity; metallic posts; microstrip line; microwave circuit elements; thin dielectric slab; Conducting materials; Coupling circuits; Dielectric materials; Dielectric measurements; Dielectric substrates; Filling; Microstrip; Microwave circuits; Permittivity; Slabs; Artificial dielectric substrate; branchline coupler; microstrip line;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Microwave Techniques, 2008. COMITE 2008. 14th Conference on
  • Conference_Location
    Prague
  • Print_ISBN
    978-1-4244-2137-4
  • Electronic_ISBN
    978-1-4244-2138-1
  • Type

    conf

  • DOI
    10.1109/COMITE.2008.4569948
  • Filename
    4569948