DocumentCode :
2206844
Title :
1998 3rd International Symposium on Plasma Process-Induced Damage (Cat. No.98EX100)
fYear :
1998
fDate :
4-5 June 1998
Abstract :
The following topics were dealt with: plasma damage and yield effects; measurement techniques; plasma process impact on scaling; topography charging modeling; plasma reactor design and topographic charging; test structures; front-end processing; back-end processing
Keywords :
plasma materials processing; sputter etching; back-end processing; front-end processing; measurement techniques; plasma process induced damage; plasma reactor design; scaling; test structures; topography charging; yield;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Plasma Process-Induced Damage, 1998 3rd International Symposium on
Conference_Location :
Honolulu, HI, USA
Print_ISBN :
0-9651577-2-5
Type :
conf
DOI :
10.1109/PPID.1998.725558
Filename :
725558
Link To Document :
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