• DocumentCode
    2207337
  • Title

    Development of an infrared thermopile detector with a thin self-supporting SU-8 membrane

  • Author

    Mattsson, C.G. ; Thungström, G. ; Bertilsson, K. ; Nilsson, H.E. ; Martin, Hans

  • Author_Institution
    Mid Sweden Univ., Sundsvall
  • fYear
    2007
  • fDate
    28-31 Oct. 2007
  • Firstpage
    836
  • Lastpage
    839
  • Abstract
    In this paper we present the development and characterization of thermopile detector on a 4 mum thin self-supporting membrane made of the epoxy based photoresist SU-8. The membrane is realized using silicon bulk micromachining techniques. In many existing thermopile detectors, a temperature difference over the thermocouple junctions is achieved by connecting a thin membrane of either Si or Si3N4 to a silicon bulk. These materials suffer from relatively high thermal conductivity, which lowers the sensitivity of the detector. A material such as SU-8 has much lower thermal conductivity and is applied using standard photolithographic processing steps. Simulation results are presented which verifies SU-8 as a better choice than Si and Si3N4 when used as thermal insulating membrane in a thermopile detector. A thermopile consisting of 196 series coupled Ti/Ni thermocouples has been fabricated. Results from measurements are presented, showing a sensitivity of 5.6 V/W and a noise equivalent power (NEP) of 9.9 nW/radicHz.
  • Keywords
    infrared detectors; photoresists; thermal conductivity; thermocouples; thermopiles; epoxy based photoresist SU-8; infrared thermopile detector; silicon bulk micromachining techniques; size 4 mum; standard photolithographic processing steps; thermal conductivity; thermal insulating membrane; thermocouple junctions; thin membrane; thin self-supporting SU-8 membrane; Biomembranes; Conducting materials; Infrared detectors; Insulation; Joining processes; Micromachining; Resists; Silicon; Temperature sensors; Thermal conductivity;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Sensors, 2007 IEEE
  • Conference_Location
    Atlanta, GA
  • ISSN
    1930-0395
  • Print_ISBN
    978-1-4244-1261-7
  • Electronic_ISBN
    1930-0395
  • Type

    conf

  • DOI
    10.1109/ICSENS.2007.4388531
  • Filename
    4388531