DocumentCode
2207692
Title
Electrical degradation of CMOS devices due to focused ion beam exposure
Author
Benbrik, J. ; Perdu, P. ; Benteo, B. ; Desplats, R. ; Labat, N. ; Touboul, A. ; Danto, Y.
Author_Institution
SOREP Lab., CNES, Toulouse, France
fYear
1998
fDate
4-5 Jun 1998
Firstpage
128
Lastpage
131
Abstract
Focused ion beams degrade CMOS devices by charging up the device surface. The presence of ions on the device surface is comparable to a plasma. We have performed measurements on CMOS test devices, and have hence modeled the influence of focused ion beams on transistors below the passivation layer. An in-depth analysis of these results has allowed us to characterize the modification of intrinsic parameters down to the semiconductor level. We have extracted these parameters in order to simulate FIB induced degradation on integrated circuits. These simulations aim to predict the impact of FIBs on the reliability of integrated circuits under irradiation
Keywords
CMOS integrated circuits; circuit simulation; focused ion beam technology; integrated circuit modelling; integrated circuit reliability; integrated circuit testing; ion beam effects; passivation; CMOS device degradation; CMOS devices; CMOS test device measurements; FIB induced degradation simulation; FIB irradiation; IC reliability; device surface; electrical degradation; focused ion beam effects; focused ion beam exposure; focused ion beams; integrated circuits; intrinsic parameter modification; model; passivation layer; semiconductor level parameters; transistors; Circuit simulation; Degradation; Ion beams; Passivation; Performance evaluation; Plasma devices; Plasma measurements; Semiconductor device modeling; Surface charging; Testing;
fLanguage
English
Publisher
ieee
Conference_Titel
Plasma Process-Induced Damage, 1998 3rd International Symposium on
Conference_Location
Honolulu, HI
Print_ISBN
0-9651577-2-5
Type
conf
DOI
10.1109/PPID.1998.725591
Filename
725591
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