High frequency performance and packaging of power film capacitors

Author

Bentley, Jeffrey A. ; Hudis, Martin ; Kerrigan, Ralph M. ; MacDougall, Fred W.

Author_Institution

Aerovox Inc., New Bedford, MA, USA

Volume

3

fYear

1995

fDate

8-12 Oct 1995

Firstpage

2521

Abstract

This paper discusses lead terminations for dry metallized polypropylene film capacitors designed specifically for the purpose of lowering the series inductance and increasing the pulse handling performance capability required for power electronic applications. This paper also discusses issues associated with testing polymer film capacitors for power electronic applications; specifically high frequency testing, accelerated aging due to high voltage rate-of-rise wave shapes and thermal shock due to electronic assembly processing such as soldering, cleaning and encapsulating or potting

Keywords

ageing; electron device testing; life testing; packaging; polymer films; power capacitors; accelerated aging; cleaning; dry metallized polypropylene film capacitors; electronic assembly processing; encapsulating; high frequency performance; high frequency testing; high voltage rate-of-rise wave shapes; lead terminations; packaging; potting; power electronic applications; power film capacitors; pulse handling performance capability; series inductance; soldering; thermal shock; Accelerated aging; Electronic equipment testing; Electronics packaging; Frequency; Inductance; Lead; Metallization; Polymer films; Power capacitors; Power electronics;

fLanguage

English

Publisher

ieee

Conference_Titel

Industry Applications Conference, 1995. Thirtieth IAS Annual Meeting, IAS '95., Conference Record of the 1995 IEEE

Conference_Location

Orlando, FL

ISSN

0197-2618

Print_ISBN

0-7803-3008-0

Type

conf

DOI

10.1109/IAS.1995.530624

Filename

530624