DocumentCode
2208067
Title
Reliability Assessment of a RF PA Assembly with Embedded Coin Construction
Author
Zhou, J. ; Lu, H. ; Zhou, M. ; Inkman, B. ; Anderson, D. ; Johnson, B.
Author_Institution
BTS Hardware Dev., Motorola, Arlington Heights, IL
fYear
0
fDate
0-0 0
Firstpage
563
Lastpage
566
Abstract
A time efficient yet rigorous assessment is conducted for a RF (radio frequency) PA (power amplifier) assembly prototype. Sites of structural weakness of the new design are identified and reliability attributes quantitatively examined for design improvement and modification
Keywords
power amplifiers; radiofrequency amplifiers; reliability; embedded coin construction; radiofrequency power amplifier assembly; reliability assessment; structural weakness; Assembly; Circuit testing; Electric shock; Heat sinks; Packaging; Power system reliability; Prototypes; Radio frequency; Thermal force; Thermal management;
fLanguage
English
Publisher
ieee
Conference_Titel
Microelectronics, 2006 25th International Conference on
Conference_Location
Belgrade
Print_ISBN
1-4244-0117-8
Type
conf
DOI
10.1109/ICMEL.2006.1651028
Filename
1651028
Link To Document