Title :
Fault arc effects under vacuum conditions on cable bundles for space applications
Author :
Hanson, Josef ; Koenig, Dieter
Author_Institution :
High Voltage Lab., Tech. Univ. Darmstadt, Germany
Abstract :
A multitude of “arc tracking” tests on cables for space applications has been performed to improve the basic understanding of the phenomena responsible for the fault arc behaviour. The damage caused in a cable bundle develops in a complex system consisting of metallic conductors, insulation materials and arc plasma. Considering the degradation effects, vacuum as one of the applied test parameters, has turned out to be an important test environment. The investigations are based on a new test method, developed to assess the arc tracking properties of cables for space applications and was presented at different NASA Workshops. Tests were conducted with different insulation materials at cables with different AWG´s at 125 V DC and nominal currents. The tests were focused on the environment vacuum, using air only for the purpose of comparison. For some cable types, vacuum has turned out to be a worst-case environmental condition with respect to fault arc effects, such as conductor burn-off, degradation of the insulation of adjacent cables and the extension of the fault arc. This paper aims at presenting these worst case experiments in detail
Keywords :
aerospace testing; cable insulation; cable testing; electric breakdown; electrical faults; insulation testing; space vehicles; vacuum arcs; vacuum breakdown; vacuum insulation; 125 V; NASA Workshops; arc plasma; arc tracking tests; cable bundle insulation; conductor burn-off; fault arc effects; insulation breakdown tests; insulation degradation; space vehicle cables; vacuum conditions; Arc discharges; Cable insulation; Conducting materials; Degradation; Extraterrestrial phenomena; Inorganic materials; Insulation life; Performance evaluation; Testing; Vacuum arcs;
Conference_Titel :
Discharges and Electrical Insulation in Vacuum, 1996. Proceedings. ISDEIV., XVIIth International Symposium on
Conference_Location :
Berkeley, CA
Print_ISBN :
0-7803-2906-6
DOI :
10.1109/DEIV.1996.545454