Title :
Evaluation of Reflow Ovens for Lead-Free Soldering
Author :
Lempinen, J. ; Tuominen, A.
Author_Institution :
Fac. of Math. & Natural Sci., Turku Univ., Salo
Abstract :
A set of different reflow ovens were evaluated in order to determine their capabilities to produce lead-free solder joints. Thermal profiles of different reflow ovens were measured using profile equipment and the heat transfer capabilities for all of the investigated reflow ovens were evaluated by determining the time constants for heating. Thermal model used is presented. It was shown that the smaller the time constant for a reflow oven the better the heat transfer capability, and thus the smaller variation in the peak soldering temperatures. The order of superiority of investigated reflow ovens is presented
Keywords :
heat transfer; ovens; reflow soldering; solders; temperature measurement; heat transfer capabilities; lead-free solder joints; lead-free soldering; reflow ovens; soldering temperatures; thermal model; thermal profile measurement; Assembly; Belts; Environmentally friendly manufacturing techniques; Heat transfer; Heating; Lead; Ovens; Reflow soldering; Semiconductor device modeling; Temperature sensors;
Conference_Titel :
Microelectronics, 2006 25th International Conference on
Conference_Location :
Belgrade
Print_ISBN :
1-4244-0117-8
DOI :
10.1109/ICMEL.2006.1651040
