Title :
Challenges facing the semiconductor equipment industry low pressure plasma processing
Author_Institution :
Novellus Syst. Inc., San Jose, CA, USA
Abstract :
Summary form only given, as follows. This talk will focus on how the semiconductor capital equipment companies working with the plasma processing research community can meet the challenges of plasma applications of the next semiconductor device generations. A review of the current and future of the industry as it relates to plasma processing will be presented. Also, the shifting responsibilities of the IC manufacturers, the equipment suppliers and the plasma research community will be discussed.
Keywords :
integrated circuit manufacture; plasma deposition; plasma materials processing; plasma sources; semiconductor device manufacture; semiconductor technology; IC manufacturers; capital equipment companies; dielectric gap fill processes; equipment suppliers; interlevel dielectrics; low pressure plasma processing; metallization; next generation semiconductor devices; plasma deposition; plasma research community; plasma source development; plasma source geometry; reactor geometry; semiconductor equipment industry; wafer size; Electronics industry; Manufacturing industries; Metallization; Plasma applications; Plasma density; Plasma devices; Plasma materials processing; Plasma sources; Plasma stability; Semiconductor device manufacture;
Conference_Titel :
Plasma Science, 2002. ICOPS 2002. IEEE Conference Record - Abstracts. The 29th IEEE International Conference on
Conference_Location :
Banff, Alberta, Canada
Print_ISBN :
0-7803-7407-X
DOI :
10.1109/PLASMA.2002.1030460
