DocumentCode
2209251
Title
A Fast Wafer-level Test For Screening VLSI Metallization
Author
Fu, Kuan-Yu ; Mohanti, Tapan
Author_Institution
Motorola Semiconductor Products Sector
fYear
1993
fDate
24-27 Oct 1993
Firstpage
8
Lastpage
21
Keywords
Current density; Dielectrics; Fabrication; Heating; Life testing; Metallization; Temperature; Thermal conductivity; Thermal resistance; Very large scale integration;
fLanguage
English
Publisher
ieee
Conference_Titel
Integrated Reliability Workshop Final Report, 1993 International
Type
conf
DOI
10.1109/IRWS.1993.666287
Filename
666287
Link To Document