• DocumentCode
    2209878
  • Title

    Motion planning for robotic spray cleaning with environmentally safe solvents

  • Author

    Hwang, Yong K. ; Meirans, Lilita ; Drotning, William D.

  • Author_Institution
    Sandia Nat. Labs., Albuquerque, NM, USA
  • fYear
    1993
  • fDate
    8-9 Nov 1993
  • Firstpage
    49
  • Lastpage
    54
  • Abstract
    Automatic motion planning of a spray cleaning robot with collision avoidance is presented. In manufacturing environments, electronic and mechanical components are traditionally cleaned by spraying or dipping them using chlorofluorocarbon (CFC) solvents. As new scientific data show that such solvents are major causes for stratospheric ozone depletion, an alternate cleaning method is needed. Part cleaning with aqueous solvents is environmentally safe, but will require precision spraying at high pressures for extended time periods. Operator fatigue during manual spraying can decrease the quality of the cleaning process. By spraying with a robotic manipulator, the necessary spray accuracy and consistency to manufacture high-reliability components can be obtained. Our motion planner was developed to automatically generate motions for spraying robots based on the part geometry and cleaning process parameters. For spray cleaning, the requirement to reach hidden surfaces necessitates the addition of a rule-based method to the geometric motion planning
  • Keywords
    computational geometry; knowledge based systems; path planning; process control; surface treatment; accuracy; aqueous solvents; automatic motion generation; consistency; environmentally safe solvents; geometric motion planning; precision spraying; robotic manipulator; robotic spray cleaning; rule based method; Cleaning; Collision avoidance; Fatigue; Manipulators; Manufacturing; Motion planning; Robotics and automation; Robots; Solvents; Spraying;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Advanced Robotics, 1993. Can Robots Contribute to Preventing Environmental Deterioration? Proceedings, 1993 IEEE/Tsukuba International Workshop on
  • Conference_Location
    Tsukuba
  • Print_ISBN
    0-7803-1441-7
  • Type

    conf

  • DOI
    10.1109/ICAR.1993.337219
  • Filename
    337219