Title :
Reliability, thermal analysis and optimization wirability design of multi-layer PCB boards
Author :
Tian, Xijin ; Palusinski, Olgierd A.
Author_Institution :
Arizona Univ., Tucson, AZ, USA
Abstract :
This paper provides a comprehensive reliability and thermal analysis of a typical multi-layer printed wire board (PWB) wirability design. Based on some typical values of modern PWB designs, numerical solutions are provided for the junction temperature, failure rate, reliability, electrical delay and cost of typical PWBs. Then, an optimization wirability design procedure is provided by using a weighting method. The major design variable is the number of signal layers in PWB and criteria being considered are the cost, reliability and electrical performance. Monographs are provided for different design parameters
Keywords :
circuit optimisation; circuit reliability; failure analysis; printed circuits; thermal analysis; cost; design parameters; design variable; electrical delay; electrical performance; failure rate; junction temperature; multi-layer PCB boards; multi-layer printed wire board; optimisation wirability design procedure; reliability; signal layers; weighting method; Costs; Delay; Design optimization; Electronic packaging thermal management; Power system reliability; Signal design; Switches; Temperature; Thermal resistance; Wire;
Conference_Titel :
Reliability and Maintainability Symposium, 2002. Proceedings. Annual
Conference_Location :
Seattle, WA
Print_ISBN :
0-7803-7348-0
DOI :
10.1109/RAMS.2002.981673
