Title :
Measuring 6D Chip Alignment in Multi-Chip Packages
Author :
Chow, Alex ; Hopkins, David ; Ho, Ron ; Drost, Robert
Author_Institution :
VLSI Res. Group, Menlo Park
Abstract :
We present techniques to detect all six degrees of positioning of one CMOS chip relative to another using capacitance measurements. Unlike other capacitive sensing schemes, these solutions achieve sub-femofarad resolution by directly measuring coupling capacitance and rejecting parasitic capacitances. We apply these techniques to dynamically monitor the 6D alignment of chips in multi-chip packages.
Keywords :
CMOS integrated circuits; capacitance measurement; capacitive sensors; multichip modules; 6D chip alignment; CMOS chip; capacitance measurements; capacitive sensing schemes; coupling capacitance; multi chip packages; sub femofarad resolution; CMOS technology; Capacitance measurement; Coupling circuits; Electronics packaging; Monitoring; Parasitic capacitance; Position measurement; Semiconductor device measurement; Sensor systems; Spatial resolution;
Conference_Titel :
Sensors, 2007 IEEE
Conference_Location :
Atlanta, GA
Print_ISBN :
978-1-4244-1261-7
Electronic_ISBN :
1930-0395
DOI :
10.1109/ICSENS.2007.4388650
