• DocumentCode
    2210549
  • Title

    Fluid head-source reduction process technology

  • Author

    Bendz, Gerald A. ; Horan, Michael S. ; Jones, Jeffrey D. ; Tavares, Frank A.

  • Author_Institution
    Microelectronics Dept., IBM Corp., Endicott, NY, USA
  • fYear
    1994
  • fDate
    2-4 May 1994
  • Firstpage
    220
  • Lastpage
    223
  • Abstract
    The fluid head is an exciting new technology developed at IBM Endicott. It is based on the fluid bearing principle, where small volumes of high speed fluid, hold and support and process a panel. This process is confined very close to the product and is able to deliver controlled amounts of fluids resulting in: less water usage; emission reduction; better chemical containment; reduced atomization; less hazardous waste; and less energy consumption. In this paper, comparisons of equipment utilizing the fluid head in rinsing, and drying devices are compared with conventional dip and spray processes. Parameters of ionic contamination, debris removal, electrical usage, as well as water usage and reduction in floor space are compared
  • Keywords
    drying; energy conservation; printed circuit manufacture; IBM Endicott; PCB manufacture; chemical containment; debris removal; drying; electrical usage; emission reduction; fluid bearing principle; fluid head; high speed fluid; ionic contamination; less energy consumption; less hazardous waste; less water usage; panel processing; panel support; reduced atomization; rinsing; source reduction process technology; Counting circuits; Energy consumption; Magnetic heads; Printed circuits; Spraying;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electronics and the Environment, 1994. ISEE 1994., Proceedings., 1994 IEEE International Symposium on
  • Conference_Location
    San Francisco, CA
  • Print_ISBN
    0-7803-1769-6
  • Type

    conf

  • DOI
    10.1109/ISEE.1994.337254
  • Filename
    337254