DocumentCode
2210549
Title
Fluid head-source reduction process technology
Author
Bendz, Gerald A. ; Horan, Michael S. ; Jones, Jeffrey D. ; Tavares, Frank A.
Author_Institution
Microelectronics Dept., IBM Corp., Endicott, NY, USA
fYear
1994
fDate
2-4 May 1994
Firstpage
220
Lastpage
223
Abstract
The fluid head is an exciting new technology developed at IBM Endicott. It is based on the fluid bearing principle, where small volumes of high speed fluid, hold and support and process a panel. This process is confined very close to the product and is able to deliver controlled amounts of fluids resulting in: less water usage; emission reduction; better chemical containment; reduced atomization; less hazardous waste; and less energy consumption. In this paper, comparisons of equipment utilizing the fluid head in rinsing, and drying devices are compared with conventional dip and spray processes. Parameters of ionic contamination, debris removal, electrical usage, as well as water usage and reduction in floor space are compared
Keywords
drying; energy conservation; printed circuit manufacture; IBM Endicott; PCB manufacture; chemical containment; debris removal; drying; electrical usage; emission reduction; fluid bearing principle; fluid head; high speed fluid; ionic contamination; less energy consumption; less hazardous waste; less water usage; panel processing; panel support; reduced atomization; rinsing; source reduction process technology; Counting circuits; Energy consumption; Magnetic heads; Printed circuits; Spraying;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronics and the Environment, 1994. ISEE 1994., Proceedings., 1994 IEEE International Symposium on
Conference_Location
San Francisco, CA
Print_ISBN
0-7803-1769-6
Type
conf
DOI
10.1109/ISEE.1994.337254
Filename
337254
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