Title :
A fully integrated 24 GHz SiGe receiver chip in a low-cost QFN plastic package
Author :
Gresham, Ian ; Kinayman, Noyan ; Jenkins, Alan ; Point, Robert ; Street, Andy ; Lu, Yumin ; Khalil, Adil ; Ito, Ryosuke ; Anderson, Richard
Author_Institution :
M/A-COM, Tyco Electron. Co., Lowell, MA
Abstract :
A fully integrated, plastic packaged, 24 GHz SiGe receiver chip is presented. The chip has been manufactured using a commercially available SiGe foundry process. It can be used in a variety of applications including automotive radar sensors and phased-array receivers. The receiver supports two channels which can be used to support sum and delta antenna pattern inputs. The receiver comprises of two LNAs, a DPST switch, an I/Q downconverter, baseband variable gain amplifiers, and integrate-and-dump filters. The receiver has 45 dB of conversion gain with 7.8 dB noise figure (with plastic package) at 24 GHz
Keywords :
Ge-Si alloys; antenna radiation patterns; foundries; integrated circuit packaging; low noise amplifiers; microwave integrated circuits; microwave receivers; plastic packaging; 24 GHz; 45 dB; 7.8 dB; DPST switch; I/Q downconverter; LNA; QFN plastic package; SiGe; SiGe foundry process; SiGe receiver chip; antenna pattern inputs; automotive radar sensors; baseband variable gain amplifiers; conversion gain; integrate-and-dump filters; noise figure; phased-array receivers; Automotive engineering; Foundries; Gain; Germanium silicon alloys; Manufacturing processes; Plastic packaging; Radar antennas; Radar applications; Silicon germanium; Switches;
Conference_Titel :
Radio Frequency Integrated Circuits (RFIC) Symposium, 2006 IEEE
Conference_Location :
San Francisco, CA
Print_ISBN :
0-7803-9572-7
DOI :
10.1109/RFIC.2006.1651158
