Title :
The NCMS Green Design Advisor, a CAE tool for environmentally conscious design
Author :
Wixom, Michael R.
Author_Institution :
Nat. Center for Manuf. Sci., Ann Arbor, MI, USA
Abstract :
The NCMS Green Design Advisor is a CAE design tool to help manufacturers minimize the environmental impacts of electro-mechanical products. This tool will generate a product feature-based rating that gives the designer a basis for reducing environmental impacts associated with the manufacture, use, and disposition of the product. This analytical tool will provide support to the designer early in the product development cycle when it is most efficient to address environmental costs and impacts. A user-driven development plan will ensure end-user acceptance and maximize multi-industry applicability. In this paper the authors discuss user needs and the benefits of a collaborative industry-driven approach in meeting these needs. The authors evaluate technical risks and functional limitations in developing a first generation Green Design Advisor. They conclude by suggesting a general technical approach to develop and validate a prototype green design tool. The initial prototype tool and validation exercises will focus on products consisting generically of printed wiring boards in metal or plastic housings
Keywords :
CAD/CAM; packaging; printed circuit design; CAE tool; NCMS Green Design Advisor; collaborative industry-driven approach; electro-mechanical products; end-user acceptance; environmental impacts minimisation; environmentally conscious design; metal housings; multi-industry applicability; plastic housings; printed wiring boards; product feature-based rating; technical risks; user-driven development plan; Collaborative tools; Computer aided engineering; Computer aided manufacturing; Design automation; Design engineering; Design for disassembly; Manufacturing processes; Process design; Product design; Prototypes;
Conference_Titel :
Electronics and the Environment, 1994. ISEE 1994., Proceedings., 1994 IEEE International Symposium on
Conference_Location :
San Francisco, CA
Print_ISBN :
0-7803-1769-6
DOI :
10.1109/ISEE.1994.337263