• DocumentCode
    2210927
  • Title

    Hewlett-Packard´s approach to creating a life cycle (product stewardship) program

  • Author

    Bast, Cliff

  • Author_Institution
    Hewlett-Packard Co., Palo Alto, CA, USA
  • fYear
    1994
  • fDate
    2-4 May 1994
  • Firstpage
    31
  • Lastpage
    36
  • Abstract
    Hewlett Packard (HP) view product stewardship as a philosophy and practice of designing products and their associated accessories and processes to prevent and/or minimize adverse health, safety and ecological impacts throughout their life cycle, i.e., design, manufacture, distribution, use, take-back, disassembly, reuse, recycling and ultimate disposition of constituent parts and materials. Thus, HP´s environmental program has expanded its focus beyond manufacturing facilities to also consider product shipment, use by the customer and eventual disposition at the end of the product´s useful life. Also taken into account are the possible environmental impacts that may occur “upstream” with respect to HP´s suppliers´ manufacture of materials, parts and components used in HP´s products. This new product stewardship philosophy represents a major change in perspective and is bringing attention to the fact that much, and often most, of the environmental impacts associated with products occur beyond manufacturing facilities
  • Keywords
    concurrent engineering; design engineering; ecology; management; pollution; safety; waste disposal; Hewlett Packard; USA; design; disassembly; disposition; distribution; ecology; environmental impact; health; life cycle; manufacture; product shipment; product stewardship; recycling; reuse; safety; take-back; use; Effluents; Environmental management; Health and safety; Manufacturing processes; Milling machines; Packaging; Pollution; Production facilities; Protection; Waste management;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electronics and the Environment, 1994. ISEE 1994., Proceedings., 1994 IEEE International Symposium on
  • Conference_Location
    San Francisco, CA
  • Print_ISBN
    0-7803-1769-6
  • Type

    conf

  • DOI
    10.1109/ISEE.1994.337279
  • Filename
    337279