Title :
Electronic packaging adhesive fatigue life prediction using thermal cycling step-stress testing
Author :
Tian, Xijin ; Prince, John L.
Author_Institution :
Arizona Univ., Tucson, AZ, USA
Abstract :
In this research, a methodology of using step-stress thermal cycling to predict fatigue life for a specific electronic packaging adhesive is established. Numerical solutions are generated using FEA software and these data are compared to test data
Keywords :
adhesives; circuit analysis computing; circuit reliability; fatigue testing; finite element analysis; thermal analysis; thermal management (packaging); FEA software; computer simulation; electronic packaging adhesive fatigue life prediction; numerical solutions; reliability calculations; thermal cycling step-stress testing; Electronic equipment testing; Electronic packaging thermal management; Electronics packaging; Fatigue; Frequency; Life estimation; Life testing; Software testing; Thermal loading; Thermal stresses;
Conference_Titel :
Reliability and Maintainability Symposium, 2002. Proceedings. Annual
Conference_Location :
Seattle, WA
Print_ISBN :
0-7803-7348-0
DOI :
10.1109/RAMS.2002.981713
