Title :
Ablation plasma ion implantation (APII) for deposition of metal coatings
Author :
Gilgenbach, Ronald M. ; Qi, B. ; Lau, Y.Y. ; Johnston, Mark D. ; Jones, M.C. ; Doll, G.L. ; Lazarides, A.
Author_Institution :
Nucl. Eng. & Radiol. Sci. Dept., Michigan Univ., Ann Arbor, MI, USA
Abstract :
Summary form only given, as follows. We present experimental results on a novel technique for deposition and implantation of metal coatings by means of ions generated by KrF laser ablation of metals. The pulse-biased substrate accelerates ablated ions. APII was initially demonstrated by implanting iron ions into silicon substrates at bias voltages up to negative 10 kV. Materials have been analyzed by Transmission Electron Microscopy (TEM) and X-ray Photoelectron Spectroscopy (XPS). Results definitively show that ion implantation has occurred, consistent with a maximum effective ion energy of about 8 keV. The lower effective energy is due to voltage droop and limited penetration of the overlying Fe film. XPS performed during an argon ion etch shows a depth profile confirming Fe implantation and deposition on the Si substrate. APII ion bombardment amorphizes the deposited film. Plasma diagnostics include: dye-laser interferometry, optical emission spectroscopy, Langmuir probe and Faraday cup for species identification as well as electron and ion densities and temperatures. Most recently, research has concentrated on ion implantation and deposition of hard coatings over softer metals, e.g., Ti over Al. Atomic force microscopy (AFM) data show that the APII deposited Ti film is smoother than the baseline laser-deposited film. A substrate bias voltage of -4 kV is adequate for smoothing to occur on Ti films over 6061 alloy Al substrates.
Keywords :
Langmuir probes; X-ray photoelectron spectra; atomic force microscopy; coating techniques; electron density; ion density; laser ablation; metals; plasma density; plasma deposition; plasma diagnostics; plasma immersion ion implantation; plasma temperature; sputter etching; titanium; transmission electron microscopy; -10 kV; -4 kV; 6061 alloy Al substrates; 8 keV; Al-Mg-Si; Ar ion etch; Faraday cup; Fe implantation; Fe ions; KrF; KrF laser ablation; Langmuir probe; Si; Si substrate; Si substrates; TEM; Ti; Ti over Al; X-ray photoelectron spectroscopy; XPS; ablation plasma ion implantation; atomic force microscopy; bias voltages; deposition; depth profile; dye-laser interferometry; effective energy; electron densities; electron temperatures; hard coatings; ion densities; ion implantation; ion temperatures; laser-deposited film; limited penetration; maximum effective ion energy; metal coatings; metals; optical emission spectroscopy; overlying Fe film; plasma diagnostics; pulse-biased substrate; softer metals; species identification; substrate bias voltage; transmission electron microscopy; voltage droop; Atomic force microscopy; Coatings; Ion implantation; Iron; Optical films; Plasma immersion ion implantation; Pulsed laser deposition; Substrates; Transmission electron microscopy; Voltage;
Conference_Titel :
Plasma Science, 2002. ICOPS 2002. IEEE Conference Record - Abstracts. The 29th IEEE International Conference on
Conference_Location :
Banff, Alberta, Canada
Print_ISBN :
0-7803-7407-X
DOI :
10.1109/PLASMA.2002.1030540