DocumentCode
2211264
Title
High performance CMOS device technologies in nano CMOS era
Author
Takagi, Shinichi
Author_Institution
Komukai Toshiba-cho, Kawasaki
Volume
1
fYear
2006
fDate
22-25 Oct. 2006
Firstpage
86
Lastpage
87
Abstract
This paper reviews the results on the development of these carrier-transport-enhanced CMOS structures based on global novel substrate technologies and the combination of local techniques with them. Here, there are two new directions for the development of the global substrate technologies including new materials such as Ge and III-Vs. The other direction is the combination of any local formation technologies, allowing us to separately optimize the strain configuration and the channel materials for n-and p-MOSFETs for maximizing the CMOS performance.
Keywords
CMOS integrated circuits; MOSFET; nanoelectronics; MOSFET; carrier-transport-enhanced CMOS structure; channel material; global substrate technology; nano CMOS device technology; CMOS technology; Capacitive sensors; Compressive stress; Electron mobility; FinFETs; III-V semiconductor materials; MOS devices; MOSFET circuits; Substrates; Uniaxial strain;
fLanguage
English
Publisher
ieee
Conference_Titel
Nanotechnology Materials and Devices Conference, 2006. NMDC 2006. IEEE
Conference_Location
Gyeongju
Print_ISBN
978-1-4244-0541-1
Electronic_ISBN
978-1-4244-0541-1
Type
conf
DOI
10.1109/NMDC.2006.4388701
Filename
4388701
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