• DocumentCode
    2211409
  • Title

    High Accuracy Die Mechanical Stress Measurement with the ATC04 Assembly Test Chip

  • Author

    Sweet, James N. ; Peterson, David W.

  • Author_Institution
    Sandia National Laboratories
  • fYear
    1993
  • fDate
    24-27 Oct 1993
  • Firstpage
    90
  • Lastpage
    97
  • Keywords
    Assembly; Integrated circuit packaging; Mechanical variables measurement; Piezoresistance; Reflow soldering; Semiconductor device measurement; Stress measurement; Temperature; Testing; Thermal stresses;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Integrated Reliability Workshop Final Report, 1993 International
  • Type

    conf

  • DOI
    10.1109/IRWS.1993.666296
  • Filename
    666296
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=2211409