Title :
A Hollow-GCPW (HGCPW) as Low-Loss and Wafer-Conductivity-Free Structure on a Single Silicon Wafer
Author :
Nishino, Tamotsu ; Yoshida, Yukihisa ; Suehiro, Yoshiyuki ; Lee, Sang-Seok ; Miyaguchi, Kenichi ; Fukall1i, Tatsuya ; Oh-hashi, Hideyuki ; Ishida, Osami
Author_Institution :
Mitsubishi Electric Co. Information Technology R&D Center, Tel: +81-467-41-2686, Fax: +81-467-41-2519, e-mail: nishino@isl.melco.co.jp
Abstract :
A low-loss hollow grounded co-planar Waveguide (HGCPW) suitable for a transmission line on a low-resistivity silicon wafer is presented. The HGCPW is disposed in a newly developed dielectric-air-metal (DAM) cavity. which consists of an SiN membrane above a fully metallized cavity made by a micromachining process. Low-loss property is achieved by removing substrate between a signal line and grounds. Existence of a bottom ground metal realizes wafer-conducthity-free structure on a low-resistivity silicon wafer by isolating the line from the substrate completely. Also, the bottom ground enables the impedance to be 50 ohm with narrow line width. HGCPWs on the 6-¿m and 30-¿m DAM cavities were fabricated and tested. The measured losses were about 0.3 dB/mm and 0.1 dB/mm respectively at 12 GHz.
Keywords :
Biomembranes; Coplanar transmission lines; Dielectric substrates; Hollow waveguides; Impedance; Loss measurement; Metallization; Micromachining; Silicon compounds; Testing;
Conference_Titel :
Microwave Conference, 2003 33rd European
Conference_Location :
Munich, Germany
Print_ISBN :
1-58053-834-7
DOI :
10.1109/EUMA.2003.340821