• DocumentCode
    2212414
  • Title

    Role of nanostructures in reducing thermal conductivity below alloy limit in crystalline solids

  • Author

    Kim, Woochul ; Singer, Suzanne ; Majumdar, Arun ; Zide, Joshua ; Gossard, Arthur ; Shakouri, Ali

  • Author_Institution
    Dept. of Mech. Eng., California Univ., Berkeley, CA, USA
  • fYear
    2005
  • fDate
    19-23 June 2005
  • Firstpage
    9
  • Lastpage
    12
  • Abstract
    Atomic substitution in alloys can efficiently scatter phonons, thereby significantly reducing the thermal conductivity in crystalline solids to the "alloy limit". It has been difficult to beat the alloy limit without creating defects, dislocations, and voids, which also reduce electrical conductivity, making it ineffective for increasing the material\´s thermoelectric figure of merit. Using In0.53Ga0.47As containing epitaxially embedded ErAs nanoislands a few nm in size, we demonstrate thermal conductivity reduction by almost a factor of two below the alloy limit, and corresponding increase in thermoelectric figure of merit by more than a factor of two. A theoretical model suggests that while point defects in alloys efficiently scatter short wavelength phonons, the ErAs nanoislands provides additional scattering mechanism for the mid to long wavelength phonon - the combination reduces the thermal conductivity below the alloy limit.
  • Keywords
    III-V semiconductors; dislocations; electrical conductivity; erbium compounds; gallium arsenide; indium compounds; island structure; nanostructured materials; phonons; point defects; thermal conductivity; thermoelectricity; voids (solid); In0.53Ga0.47As-ErAs; alloy limit; atomic substitution; crystalline solids; dislocations; electrical conductivity; epitaxially embedded nanoislands; long wavelength phonon; nanostructures; point defects; scattering mechanism; short wavelength phonons; thermal conductivity; thermoelectric figure of merit; voids; Crystallization; Gallium alloys; Nanostructures; Phonons; Scattering; Semiconductor process modeling; Solids; Thermal conductivity; Thermal factors; Thermoelectricity;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Thermoelectrics, 2005. ICT 2005. 24th International Conference on
  • ISSN
    1094-2734
  • Print_ISBN
    0-7803-9552-2
  • Type

    conf

  • DOI
    10.1109/ICT.2005.1519874
  • Filename
    1519874