DocumentCode
2212414
Title
Role of nanostructures in reducing thermal conductivity below alloy limit in crystalline solids
Author
Kim, Woochul ; Singer, Suzanne ; Majumdar, Arun ; Zide, Joshua ; Gossard, Arthur ; Shakouri, Ali
Author_Institution
Dept. of Mech. Eng., California Univ., Berkeley, CA, USA
fYear
2005
fDate
19-23 June 2005
Firstpage
9
Lastpage
12
Abstract
Atomic substitution in alloys can efficiently scatter phonons, thereby significantly reducing the thermal conductivity in crystalline solids to the "alloy limit". It has been difficult to beat the alloy limit without creating defects, dislocations, and voids, which also reduce electrical conductivity, making it ineffective for increasing the material\´s thermoelectric figure of merit. Using In0.53Ga0.47As containing epitaxially embedded ErAs nanoislands a few nm in size, we demonstrate thermal conductivity reduction by almost a factor of two below the alloy limit, and corresponding increase in thermoelectric figure of merit by more than a factor of two. A theoretical model suggests that while point defects in alloys efficiently scatter short wavelength phonons, the ErAs nanoislands provides additional scattering mechanism for the mid to long wavelength phonon - the combination reduces the thermal conductivity below the alloy limit.
Keywords
III-V semiconductors; dislocations; electrical conductivity; erbium compounds; gallium arsenide; indium compounds; island structure; nanostructured materials; phonons; point defects; thermal conductivity; thermoelectricity; voids (solid); In0.53Ga0.47As-ErAs; alloy limit; atomic substitution; crystalline solids; dislocations; electrical conductivity; epitaxially embedded nanoislands; long wavelength phonon; nanostructures; point defects; scattering mechanism; short wavelength phonons; thermal conductivity; thermoelectric figure of merit; voids; Crystallization; Gallium alloys; Nanostructures; Phonons; Scattering; Semiconductor process modeling; Solids; Thermal conductivity; Thermal factors; Thermoelectricity;
fLanguage
English
Publisher
ieee
Conference_Titel
Thermoelectrics, 2005. ICT 2005. 24th International Conference on
ISSN
1094-2734
Print_ISBN
0-7803-9552-2
Type
conf
DOI
10.1109/ICT.2005.1519874
Filename
1519874
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