DocumentCode
2212573
Title
Building-In Reliability During Product Development in IBM Microelectronics
Author
Rathore, H.S. ; Wactilk, R.A. ; Filippi, R. ; Gajda, J.
Author_Institution
IBM Microelectronics Division
fYear
1993
fDate
24-27 Oct 1993
Firstpage
124
Lastpage
143
Keywords
Electromigration; Insulation; Integrated circuit reliability; Manufacturing processes; Materials reliability; Microelectronics; Nonhomogeneous media; Product development; Qualifications; Robustness;
fLanguage
English
Publisher
ieee
Conference_Titel
Integrated Reliability Workshop Final Report, 1993 International
Type
conf
DOI
10.1109/IRWS.1993.666301
Filename
666301
Link To Document