Title :
Three-dimensional bochip microarray using magnetic force interaction and self-assembly
Author :
Choi, Yong-Sung ; Moon, Jong-Dae ; Kwon, Young-Soo ; Lee, Kyung-Sup
Author_Institution :
Dept. of Electr. Eng., Dongshin Univ., Naju
Abstract :
This paper describes a new constructing method of multifunctional biosensor using many kinds of biomaterials. A metal particle and an array were fabricated by photolithographic. The metal particles were in a multilayer structure (Au, Ti, and Ni). Biomaterials were immobilized on the metal particle. Sidewalls of patterned Ni dots on the array were covered by thick negative photoresist (SU-8), and the array was magnetized. The array and the particles were mixed in a buffer solution, and were arranged by magnetic force interaction and random fluidic self-assembly. Binding direction of the metal particle onto Ni dots was controlled by multilayer structure and direction of magnetization. A quarter of total Ni dots were covered by the particles. The binding direction of the particles was controllable, and condition of particles was almost with Au surface on top. The particles were successfully arranged on the array. The biomaterial activities were detected by chemiluminescence and electrochemical methods.
Keywords :
bioMEMS; biosensors; chemiluminescence; electrochemical analysis; gold; magnetic forces; nickel; photoresists; self-assembly; titanium; 3D biochip microarray; Au; Au - Element; Ni; Ni - Element; Ni dots; Ti; Ti - Element; binding direction; biomaterials; chemiluminescence method; electrochemical methods; magnetic force interaction; metal particle; multifunctional biosensor; multilayer structure; negative photoresist; random fluidic self-assembly; Biochemistry; Biosensors; Chemical and biological sensors; DNA; Gold; Magnetic forces; Magnetic multilayers; Self-assembly; Semiconductor device measurement; Sensor arrays; DNA; biochip; hybridization; hydrophili; magnetic force; self-assembly;
Conference_Titel :
Nanotechnology Materials and Devices Conference, 2006. NMDC 2006. IEEE
Conference_Location :
Gyeongju
Print_ISBN :
978-1-4244-0540-4
Electronic_ISBN :
978-1-4244-0541-1
DOI :
10.1109/NMDC.2006.4388760