• DocumentCode
    2212853
  • Title

    High Voltage Insulation Failure Mechanisms

  • Author

    Bruetsch, Rudolf

  • Author_Institution
    Von Roll Switzerland Ltd., Breitenbach
  • fYear
    2008
  • fDate
    9-12 June 2008
  • Firstpage
    162
  • Lastpage
    165
  • Abstract
    There are many statistics dealing with failure causes of high voltage rotating machines. While these statistics prove the relevance of the insulation as failure cause, they give little information on the real failure mechanism. This paper gives results of a research project which was launched to investigate degradation and final breakdown of the mica insulation in rotating machines. Final failure of the insulation is usually caused by electric breakdown through a tree channel. Formation and propagation of trees in the mica insulation therefore reflect the ageing process of the insulation. Dominating ageing factors of the mica insulation are thermal and mechanical stress. Manufacturing defects of the mica insulation - such as delaminations, cracks, voids and wrinkled or damaged mica layers - accelerate the formation and propagation of trees. Good workmanship and proper selection and application of the insulation materials are important factors for the lifetime of high voltage rotating machines.
  • Keywords
    ageing; electric breakdown; electric machines; insulation testing; mica; thermal stresses; Al2O3-K2O-SiO2; ageing; electric breakdown; high voltage insulation failure; high voltage rotating machines; mechanical stress; mica insulation; thermal stress; Aging; Degradation; Dielectrics and electrical insulation; Electric breakdown; Failure analysis; Rotating machines; Statistics; Thermal factors; Trees - insulation; Voltage;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electrical Insulation, 2008. ISEI 2008. Conference Record of the 2008 IEEE International Symposium on
  • Conference_Location
    Vancouver, BC
  • ISSN
    1089-084X
  • Print_ISBN
    978-1-4244-2091-9
  • Electronic_ISBN
    1089-084X
  • Type

    conf

  • DOI
    10.1109/ELINSL.2008.4570301
  • Filename
    4570301