DocumentCode :
2213006
Title :
Ultralow impedance evaluation system of wideband frequency for power distribution network of decoupling capacitor embedded substrates
Author :
Kikuchi, Katsuya ; Takemura, Koichi ; Ueda, Chihiro ; Shimada, Osamu ; Gomyo, Toshio ; Takeuchi, Yukiharu ; Okubo, Toshikazu ; Baba, Kazuhiro ; Aoyagi, Masahiro ; Sudo, Toshio ; Otsuka, Kanji
Author_Institution :
NeRI, AIST Tsukuba Central 2, Nat. Inst. of Adv. Ind. Sci. & Technol. (AIST), Tsukuba, Japan
fYear :
2009
fDate :
28-30 Sept. 2009
Firstpage :
1
Lastpage :
4
Abstract :
We developed an impedance analyzer system with a wide frequency range for evaluating ultralow impedance. The four-point impedance measurement technique is introduced using this system. This impedance measurement can be reliably and accurately carried out by a four-point technique where one pair of contacts is used to inject a signal into the device under test (DUT), and a second pair of contacts is used to sense the resulting signal across the DUT. As a result, an evaluation system for the tens of micro-ohms of trans-impedance Z21 in the frequency range of 10 Hz to 40 GHz can be realized. By using two microwave contact probes, PDN impedance evaluation with contacted pads is realized. Therefore, the PDN impedance can be measured directly without the connectors during the measurement. Moreover, it is expected that the accurate and wideband impedance evaluation of a substrate with an electromagnetic band gap (EBG) structure can be realized.
Keywords :
capacitors; distribution networks; electric impedance measurement; embedded systems; millimetre wave devices; photonic band gap; decoupling capacitor embedded substrates; device-under-test; electromagnetic band gap structure; four-point technique; frequency 10 Hz to 40 GHz; impedance analyzer system; impedance measurement; microwave contact probes; power distribution network; wideband frequency; Capacitors; Contacts; Electromagnetic measurements; Frequency; Impedance measurement; Periodic structures; Power system reliability; Power systems; Testing; Ultra wideband technology;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
3D System Integration, 2009. 3DIC 2009. IEEE International Conference on
Conference_Location :
San Francisco, CA
Print_ISBN :
978-1-4244-4511-0
Electronic_ISBN :
978-1-4244-4512-7
Type :
conf
DOI :
10.1109/3DIC.2009.5306526
Filename :
5306526
Link To Document :
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