• DocumentCode
    2213066
  • Title

    Improving Epoxy-based Insulating Materials with Nano-fillers toward Practical Application

  • Author

    Imai, Takahiro ; Komiya, Gen ; Murayama, Kiyoko ; Ozaki, Tamon ; Sawa, Fumio ; Shimizu, Toshio ; Harada, Miyuki ; Ochi, Mitsukazu ; Ohki, Yoshimichi ; Tanaka, Toshikatsu

  • Author_Institution
    Power & Ind. Syst. R&D Center, Toshiba Corp., Fuchu
  • fYear
    2008
  • fDate
    9-12 June 2008
  • Firstpage
    201
  • Lastpage
    204
  • Abstract
    A primary concern in recent nanocomposite research is practical application. In this study, various kinds of epoxy-based nanocomposites were made and their properties evaluated to determine their applicability as insulating materials for heavy electric apparatuses. Experimental results demonstrated that nano-fillers enhance insulation breakdown properties in nanocomposites. Moreover, nano- and micro-filler combinations were adopted as an approach toward practical application of nanocomposite insulating materials. These nano- and micro- filler mixed composites had the same low thermal expansion as aluminum, and insulation breakdown properties superior to those of conventional insulating materials. Consequently, an aluminum conductor and a vacuum interrupter were molded by the nano- and micro-filler mixed composites for the first time in nanocomposite research.
  • Keywords
    aluminium; electric breakdown; epoxy insulation; filled polymers; nanocomposites; thermal expansion; vacuum interrupters; Al; aluminum conductor; electric apparatus; epoxy-based nanocomposite insulating material; insulation breakdown properties; microfiller mixed composites; nanofiller mixed composites; thermal expansion; vacuum interrupter; Aluminum; Bit error rate; Casting; Composite materials; Conducting materials; Curing; Dielectric materials; Dielectrics and electrical insulation; Epoxy resins; Nanostructured materials;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electrical Insulation, 2008. ISEI 2008. Conference Record of the 2008 IEEE International Symposium on
  • Conference_Location
    Vancouver, BC
  • ISSN
    1089-084X
  • Print_ISBN
    978-1-4244-2091-9
  • Electronic_ISBN
    1089-084X
  • Type

    conf

  • DOI
    10.1109/ELINSL.2008.4570310
  • Filename
    4570310