DocumentCode
2213191
Title
ESD performance evaluation of powered high-speed interfaces
Author
Koch, Sebastian ; Gossner, Harald ; Gieser, Horst ; Maurer, Linus
Author_Institution
Intel Deutschland GmbH, Neubiberg, Germany
fYear
2015
fDate
16-22 Aug. 2015
Firstpage
1101
Lastpage
1105
Abstract
An approach towards evaluating the ESD performance of high-speed interfaces is presented. By applying ESD stress to powered USB 3.0 interfaces the propagation of very short ESD pulses is investigated. Soft failures caused by TLP stress are put into relation to hard failure thresholds of the unpowered devices as well as soft failures induced by IEC 61000-4-2 pulses.
Keywords
Data transfer; Electrostatic discharges; IEC Standards; Magnetic fields; Probes; Stress; Universal Serial Bus; high-speed interface; soft failure; system level ESD;
fLanguage
English
Publisher
ieee
Conference_Titel
Electromagnetic Compatibility (EMC), 2015 IEEE International Symposium on
Conference_Location
Dresden, Germany
Print_ISBN
978-1-4799-6615-8
Type
conf
DOI
10.1109/ISEMC.2015.7256322
Filename
7256322
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