• DocumentCode
    2213191
  • Title

    ESD performance evaluation of powered high-speed interfaces

  • Author

    Koch, Sebastian ; Gossner, Harald ; Gieser, Horst ; Maurer, Linus

  • Author_Institution
    Intel Deutschland GmbH, Neubiberg, Germany
  • fYear
    2015
  • fDate
    16-22 Aug. 2015
  • Firstpage
    1101
  • Lastpage
    1105
  • Abstract
    An approach towards evaluating the ESD performance of high-speed interfaces is presented. By applying ESD stress to powered USB 3.0 interfaces the propagation of very short ESD pulses is investigated. Soft failures caused by TLP stress are put into relation to hard failure thresholds of the unpowered devices as well as soft failures induced by IEC 61000-4-2 pulses.
  • Keywords
    Data transfer; Electrostatic discharges; IEC Standards; Magnetic fields; Probes; Stress; Universal Serial Bus; high-speed interface; soft failure; system level ESD;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electromagnetic Compatibility (EMC), 2015 IEEE International Symposium on
  • Conference_Location
    Dresden, Germany
  • Print_ISBN
    978-1-4799-6615-8
  • Type

    conf

  • DOI
    10.1109/ISEMC.2015.7256322
  • Filename
    7256322