DocumentCode :
2213320
Title :
Known Good Die Carrier Reliability Evaluation
Author :
Agahdel, Fariborz ; Teoh, Hongbee ; Rlzzo, S.P. ; Roebuck, Randal D.
Author_Institution :
Micromodule Systems
fYear :
1993
fDate :
24-27 Oct 1993
Firstpage :
162
Lastpage :
166
Keywords :
Biomembranes; Control systems; Costs; Instruments; Materials reliability; Materials testing; Performance evaluation; Sockets; System testing; Temperature;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Integrated Reliability Workshop Final Report, 1993 International
Type :
conf
DOI :
10.1109/IRWS.1993.666304
Filename :
666304
Link To Document :
https://search.ricest.ac.ir/dl/search/defaultta.aspx?DTC=49&DC=2213320
بازگشت