DocumentCode :
2213410
Title :
Integration of vertical pnp transistors in a double-polysilicon Bi-CMOS process
Author :
de Lang, D. ; Bladt, E. ; Goor, A. V D ; Josquin, W.
Author_Institution :
Philips Res. Lab., Eindhoven, Netherlands
fYear :
1989
fDate :
18-19 Sep 1989
Firstpage :
190
Lastpage :
193
Abstract :
A cost-effective method for integrating vertical pnp transistors in an advanced double-poly BiCMOS process is discussed. The method requires only two additional masks for modification of the buried layer structure. Vertical pnp transistors with an ft of 1 GHz have been realized in combination with 7-GHz npn transistors. 2-D simulations of the buried layer process shows a greatly improved isolation and a large reduction in substrate capacitance. Both the AC and DC characteristics of the vertical pnp transistor are adequate for a wide range of analog applications
Keywords :
BIMOS integrated circuits; bipolar transistors; integrated circuit technology; linear integrated circuits; 1 GHz; 2-D simulations; 7 GHz; AC characteristics; BiCMOS; DC characteristics; buried layer process; double-polysilicon Bi-CMOS process; improved isolation; polycrystalline Si; reduction in substrate capacitance; two additional masks; vertical pnp transistor integration; Analog circuits; Boron; Capacitance; Circuit simulation; Doping profiles; Filters; Isolation technology; Laboratories; Substrates; Transistors;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Bipolar Circuits and Technology Meeting, 1989., Proceedings of the 1989
Conference_Location :
Minneapolis, MN
Type :
conf
DOI :
10.1109/BIPOL.1989.69489
Filename :
69489
Link To Document :
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