Title :
An Investigation of Key Factors in the Manufacturability and Qualification of Known Good Die Processes
Author :
VanOverloop, Don ; Walker, Scott
Author_Institution :
Motorola Inc.
Keywords :
Assembly; Bonding; Costs; Manufacturing processes; Packaging machines; Performance evaluation; Production; Qualifications; System testing; Wafer scale integration;
Conference_Titel :
Integrated Reliability Workshop Final Report, 1993 International
DOI :
10.1109/IRWS.1993.666305
