DocumentCode
2213585
Title
A PowerAmplifier Module with Fully Embedded Passive components in a LTCC Substrate for K-PCS Band Mobile Phone
Author
Kim, Erick ; Lee, Young-Shin ; oo, Chan-SeiY ; Lee, Woo-Seong ; Park, Jong-Cheol
Author_Institution
High Frequency Materials Research Center, Korea Electronics Technology Institute, # 455-6 Masan-Ri, JinWi-Myon, Py ungTaek-Si, KyungGi-Do 451-865, Korea. Tel: + 82-31- 6104-151, Fax: + 82-31- 6104-126, E-mail: kckim@keti.re.kr
fYear
2003
fDate
Oct. 2003
Firstpage
253
Lastpage
256
Abstract
Use Accurate circuit models for embedded RF passive components in LTCC(Low Temperature Co-fired Ceramics) provide a way to efficiently design high performance RFmodules. In this study, in order to increase the accuracy of circuit models, the library of components was developed and the parasitic components were extracted. And with the circuit model, the PAM(Power Amplifier Module) was developed using LTCC process. The module was fabricated with fully embedded passive components within a compact 6x6x1.2 mm3 size, and it exhibited power performance sufficient forK-PCS bandmobile phone.
Keywords
Capacitors; Ceramics; Circuits; Dielectric constant; Dielectric substrates; Electrodes; Inductors; Libraries; Mobile handsets; Radio frequency;
fLanguage
English
Publisher
ieee
Conference_Titel
Microwave Conference, 2003 33rd European
Conference_Location
Munich, Germany
Print_ISBN
1-58053-834-7
Type
conf
DOI
10.1109/EUMA.2003.340938
Filename
4143002
Link To Document