Title :
A PowerAmplifier Module with Fully Embedded Passive components in a LTCC Substrate for K-PCS Band Mobile Phone
Author :
Kim, Erick ; Lee, Young-Shin ; oo, Chan-SeiY ; Lee, Woo-Seong ; Park, Jong-Cheol
Author_Institution :
High Frequency Materials Research Center, Korea Electronics Technology Institute, # 455-6 Masan-Ri, JinWi-Myon, Py ungTaek-Si, KyungGi-Do 451-865, Korea. Tel: + 82-31- 6104-151, Fax: + 82-31- 6104-126, E-mail: kckim@keti.re.kr
Abstract :
Use Accurate circuit models for embedded RF passive components in LTCC(Low Temperature Co-fired Ceramics) provide a way to efficiently design high performance RFmodules. In this study, in order to increase the accuracy of circuit models, the library of components was developed and the parasitic components were extracted. And with the circuit model, the PAM(Power Amplifier Module) was developed using LTCC process. The module was fabricated with fully embedded passive components within a compact 6x6x1.2 mm3 size, and it exhibited power performance sufficient forK-PCS bandmobile phone.
Keywords :
Capacitors; Ceramics; Circuits; Dielectric constant; Dielectric substrates; Electrodes; Inductors; Libraries; Mobile handsets; Radio frequency;
Conference_Titel :
Microwave Conference, 2003 33rd European
Conference_Location :
Munich, Germany
Print_ISBN :
1-58053-834-7
DOI :
10.1109/EUMA.2003.340938
