• DocumentCode
    2213603
  • Title

    Thin wafer handling — Study of temporary wafer bonding materials and processes

  • Author

    Hermanowski, James

  • Author_Institution
    SUSS MicroTec, Inc., Waterbury Center, VT, USA
  • fYear
    2009
  • fDate
    28-30 Sept. 2009
  • Firstpage
    1
  • Lastpage
    5
  • Abstract
    This paper reviews the major adhesives and processes used for 3D TSV thin wafer handling, provides thermal and other performance data on the materials and processes and attempts to establish a first order estimate of process related thermal performance using a common analytical method.
  • Keywords
    adhesives; wafer bonding; 3D TSV thin wafer handling; process related thermal performance; temporary wafer bonding materials; Chemical processes; Chemical technology; Costs; Delamination; Glass; Temperature; Thermal resistance; Thermal stability; Through-silicon vias; Wafer bonding;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    3D System Integration, 2009. 3DIC 2009. IEEE International Conference on
  • Conference_Location
    San Francisco, CA
  • Print_ISBN
    978-1-4244-4511-0
  • Electronic_ISBN
    978-1-4244-4512-7
  • Type

    conf

  • DOI
    10.1109/3DIC.2009.5306550
  • Filename
    5306550
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=2213603