Title :
Thin wafer handling — Study of temporary wafer bonding materials and processes
Author :
Hermanowski, James
Author_Institution :
SUSS MicroTec, Inc., Waterbury Center, VT, USA
Abstract :
This paper reviews the major adhesives and processes used for 3D TSV thin wafer handling, provides thermal and other performance data on the materials and processes and attempts to establish a first order estimate of process related thermal performance using a common analytical method.
Keywords :
adhesives; wafer bonding; 3D TSV thin wafer handling; process related thermal performance; temporary wafer bonding materials; Chemical processes; Chemical technology; Costs; Delamination; Glass; Temperature; Thermal resistance; Thermal stability; Through-silicon vias; Wafer bonding;
Conference_Titel :
3D System Integration, 2009. 3DIC 2009. IEEE International Conference on
Conference_Location :
San Francisco, CA
Print_ISBN :
978-1-4244-4511-0
Electronic_ISBN :
978-1-4244-4512-7
DOI :
10.1109/3DIC.2009.5306550
