DocumentCode
2213804
Title
A routerless system level interconnection network for 3D integrated systems
Author
Ireland, Kelli ; Chiarulli, Donald ; Levitan, Steven
Author_Institution
Comput. Eng. Grad. Program, Univ. of Pittsburgh, Pittsburgh, PA, USA
fYear
2009
fDate
28-30 Sept. 2009
Firstpage
1
Lastpage
6
Abstract
This paper describes a new architectural paradigm for fully connected, single-hop system level interconnection networks. The architecture is scalable enough to meet the needs of next generation multicore systems and can efficiently support multiple programming models including symmetric common memory architectures. We present preliminary data from simulations of a network model and the design of a demonstration chip in stacked 3D integration technology. Our simulations demonstrate that our fully distributed routing and control system allocates system bandwidth fairly with minimal overhead, even when demand is close to network saturation.
Keywords
bandwidth allocation; memory architecture; multiprocessing programs; multiprocessing systems; multiprocessor interconnection networks; 3D integrated system; memory multiprocessor programming model; multicore system; multiple programming model; network saturation; routerless system; single-hop system level interconnection network; symmetric common memory architecture; system bandwidth allocatation; Bandwidth; CMOS technology; Distributed control; Multicore processing; Multiprocessor interconnection networks; Network topology; Routing; Semiconductor device modeling; Thermal management; Timing; 3D integrated multicore systems; Multicore interconnections; System level interconnection network;
fLanguage
English
Publisher
ieee
Conference_Titel
3D System Integration, 2009. 3DIC 2009. IEEE International Conference on
Conference_Location
San Francisco, CA
Print_ISBN
978-1-4244-4511-0
Electronic_ISBN
978-1-4244-4512-7
Type
conf
DOI
10.1109/3DIC.2009.5306557
Filename
5306557
Link To Document