• DocumentCode
    2213804
  • Title

    A routerless system level interconnection network for 3D integrated systems

  • Author

    Ireland, Kelli ; Chiarulli, Donald ; Levitan, Steven

  • Author_Institution
    Comput. Eng. Grad. Program, Univ. of Pittsburgh, Pittsburgh, PA, USA
  • fYear
    2009
  • fDate
    28-30 Sept. 2009
  • Firstpage
    1
  • Lastpage
    6
  • Abstract
    This paper describes a new architectural paradigm for fully connected, single-hop system level interconnection networks. The architecture is scalable enough to meet the needs of next generation multicore systems and can efficiently support multiple programming models including symmetric common memory architectures. We present preliminary data from simulations of a network model and the design of a demonstration chip in stacked 3D integration technology. Our simulations demonstrate that our fully distributed routing and control system allocates system bandwidth fairly with minimal overhead, even when demand is close to network saturation.
  • Keywords
    bandwidth allocation; memory architecture; multiprocessing programs; multiprocessing systems; multiprocessor interconnection networks; 3D integrated system; memory multiprocessor programming model; multicore system; multiple programming model; network saturation; routerless system; single-hop system level interconnection network; symmetric common memory architecture; system bandwidth allocatation; Bandwidth; CMOS technology; Distributed control; Multicore processing; Multiprocessor interconnection networks; Network topology; Routing; Semiconductor device modeling; Thermal management; Timing; 3D integrated multicore systems; Multicore interconnections; System level interconnection network;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    3D System Integration, 2009. 3DIC 2009. IEEE International Conference on
  • Conference_Location
    San Francisco, CA
  • Print_ISBN
    978-1-4244-4511-0
  • Electronic_ISBN
    978-1-4244-4512-7
  • Type

    conf

  • DOI
    10.1109/3DIC.2009.5306557
  • Filename
    5306557